| 摘要 |
Heat of optical devices is transferred to a bottom surface portion 512B of an optical parts housing portion 512 of an optical parts casing 5A. A duct 6 is formed on the bottom surface portion 512B. A cooling air passing through a first passage 6A cools the bottom surface portion 512B, and then is supplied to a hole 515R to cool a liquid crystal panel 441R, etc. The cooling air passing through a second passage 6B of the duct 6 is introduced into holes 515B, 515G to cool the liquid crystal panels 441B, 441G. Accordingly, the optical parts casing projector capable of cooling sufficiently the optical modulator devices and other parts, e.g., the bottom surface portion, etc. of the optical parts casing.
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