发明名称 Substrate film thickness measurement method, substrate film thickness measurement apparatus and substrate processing apparatus
摘要 A jet of water in a cylindrical form is supplied from a jet nozzle onto a measurement surface of a substrate to form a column of the water extending between the nozzle and the measurement surface. Light is emitted from an irradiation fiber and transmitted through the column of water to the measurement surface. The light reflected by the measurement surface is received by a light-receiving fiber through the column of water. A measurement calculation unit measures the thickness of a film formed on the substrate, based on the intensity of the reflected light.
申请公布号 US2004223166(A1) 申请公布日期 2004.11.11
申请号 US20040854330 申请日期 2004.05.27
申请人 KIMBA TOSHIFUMI;NAKAI SHUNSUKE 发明人 KIMBA TOSHIFUMI;NAKAI SHUNSUKE
分类号 B24B37/013;B24B37/04;B24B49/12;G01B11/06;H01L21/304;H01L21/306;H01L21/66;(IPC1-7):G01B11/28 主分类号 B24B37/013
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