| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface inspection method which enables an inspection of the surface of a material to be inspected having a plane to dect an abnormal part inclusive of the unevenness data of the detected abnormal part. <P>SOLUTION: The surface inspection method is adapted so as to inspect the abnormal parts (voids/contaminations) scattered on the surface of a polycrystalline wafer and has a step for using a low magnification object lens to allow the same to scan within the inspection region of the surface of the wafer and successively acquiring a large number of low magnification inspection images of the inspection region, a step for subjecting the low magnification inspection images to image processing to detect the abnormal parts and operating/storing the positions of them, a step for using a high magnification object lens to acquire a plurality of high magnification inspection images of the inspection region while changing an object distance at the positions of the abnormal parts and a step for calculating the position in the height direction of a normal region and the position in the height direction of the abnormal region on the basis of a plurality of the high magnification inspection images to judge whether the abnormal region is a recessed part (void) or a protruded part (contamination). <P>COPYRIGHT: (C)2005,JPO&NCIPI |
