| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a stud bump bonder having a function for forming a plurality of stud bumps on the surface of a workpiece and uniforming the height thereof easily without causing short circuit. <P>SOLUTION: The stud bump bonder for forming stud bumps on the surface of a planar workpiece and having a bonding area and a bump cutting area comprises a means for forming stud bumps on the surface of a workpiece arranged in the bonding area and positioned in the bonding area, and a means having a cutter for cutting a plurality of stud bumps formed on the surface of a workpiece arranged in the bump cutting area and positioned in the bump cutting area and uniforming the height thereof. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
