| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a card type semiconductor device allowing suppressing corrosion on copper foil of an external electrode to maintain a function as the electrode over a long period. <P>SOLUTION: This electronic circuit device has: a substrate 1 formed with the external electrode 2a and wiring 2b connected thereto; an electronic component 3 mounted on the substrate, and connected to the wiring; and a sealing resin 5 sealing the electronic component and a connection part of the wiring to the electronic component. The external electrode and the wiring have a corrosion-resistant plating layer on their upper face parts, and at least a peripheral part of the external electrode and the wiring is formed with a resin coating film 6. The resin coating film is superimposed on an outline part area of the external electrode and the wiring, and is formed on the upper face of the plating layer. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
