| 摘要 |
PROBLEM TO BE SOLVED: To improve the transmission efficiency of a high frequency signal in a package for housing a semiconductor device having a coaxial connector to which a coaxial cable is connected. SOLUTION: The package for housing the semiconductor device includes a base 1 having the placing part 1a of the semiconductor device 5, a frame 2 attached to surround the placing part 1a and having a through hole formed at a side, and the coaxial connector 3 engaged within the through hole. The through hole has the small-diameter part 2a of the inner surface side of the frame 2 with which the coaxial cable 3 is engaged, the large-diameter part 2d of the outer surface side of the frame 2 to which a cylindrical fixing member 9 made of metal is inserted fixedly for fixing the coaxial cable 10 coaxially continued with the small-diameter part 2a and electrically connected to the coaxial connector 3, and a step 2b formed on the entire periphery of the opening of the large-diameter part 2d side of the small-diameter part 2a. The cylindrical fixing member 9 is electrically connected to the outer peripheral conductor 3a via an annular member 30 made of metal disposed at the end face of the coaxial connector 3 side at the step 2b. COPYRIGHT: (C)2005,JPO&NCIPI |
