| 摘要 |
PROBLEM TO BE SOLVED: To provide a photoelectric conversion element package in which a photoelectric conversion element and an electric circuit element can be loaded with large alignment tolerances which are similar to the electrical mounting accuracy in an ordinary multi-chip module at the time of packaging the elements. SOLUTION: The photoelectric conversion element package 1 is constituted of a package A3 composed of the photoelectric conversion element 2 and a transparent material 4 sealing the element 2 and a package B8 which seals the electric circuit element 5 electrically connected to the photoelectric conversion element 2 and the package A3. The package B8 is constituted so that part 3a of the package A3 may be exposed to the outside from part of the package B8. Therefore, the photoelectric conversion element package 1 can be manufactured inexpensively, because no optical mounting is required at the time of manufacturing the photoelectric conversion element package 1 by performing sealing similar to that performed on an ordinary electrical mounting package. COPYRIGHT: (C)2005,JPO&NCIPI |
