| 摘要 |
PROBLEM TO BE SOLVED: To prevent power supply to an unnecessary semiconductor device without providing an extra process for machining the semiconductor device to turn off power. SOLUTION: Since a section 7 for supplying power to all semiconductor devices 100 mounted on a semiconductor wafer 300 and a switch, e.g. an analog switch 11, for turning the power supply of each semiconductor device 100 on/off are provided, and power supply to each semiconductor device 100 can be controlled by turning the analog switch 11 on/off with a power supply control signal 13, power supply to an unnecessary semiconductor device 100 can be prevented without providing an extra process for machining the semiconductor device 100 to turn the power supply off. When the analog switch 11 is located on the outside of the semiconductor device 100, chip size of the semiconductor device 100 can be reduced accordingly. COPYRIGHT: (C)2005,JPO&NCIPI
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