| 摘要 |
PROBLEM TO BE SOLVED: To provide a solder appearance inspection apparatus for determining the presence of a solder bridge in a relatively short processing time. SOLUTION: The solder appearance inspection apparatus 1 picks up images of pads PD disposed on a printed board and cream solders C attached to them by using a CCD camera 6 (S101). A bridge inspection frame KW for surrounding each pad PD is set (S102) in an image pick-up area of the CCD camera 6. Three-dimensional measurement is implemented in the set bridge inspection frame KW (S103). The solder having a predetermined height whose image is picked up by the CCD camera 6, is detected (S104). The presence of the solder bridge is determined based on whether a solder cluster extending from the pad PD to the bridge inspection frame KW intersects with the bridge inspection frame KW (S105, S107). COPYRIGHT: (C)2005,JPO&NCIPI
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