发明名称 APPARATUS FOR CONNECTING BETWEEN SUBSTRATES
摘要 The present invention aims to provide an apparatus for connecting between substrates capable of replacing a connector one by one. An apparatus for connecting between substrates A is provided with a connector 100 for electrically connecting an upside electrode 11 mounted at the back surface of an upside substrate 10 and a downside electrode 21 mounted at the front surface of a downside substrate 20 in a personal computer and a supporting plate 200 arranged between the upside substrate 10 and the downside substrate 20 for removably supporting the connector 100, and the connector 100 is able to be inserted into a positioning hole formed on the supporting plate 200 and has a mounting terminal 110 having a leading edge section being in contact with the downside electrode 21 and a connecting section 120 mounted at a base edge section of the mounting terminal 110 and having a leading edge section being in contact with the upside electrode 11.
申请公布号 US2004222535(A1) 申请公布日期 2004.11.11
申请号 US20030430379 申请日期 2003.05.07
申请人 MORI CHIKAOMI;TAKAHASHI HIROTADA;KAWATA MASAO;NOJIRI KENICHI 发明人 MORI CHIKAOMI;TAKAHASHI HIROTADA;KAWATA MASAO;NOJIRI KENICHI
分类号 H01L23/02;H01L23/48;H01R13/24;(IPC1-7):H01L23/02 主分类号 H01L23/02
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