发明名称 |
APPARATUS FOR CONNECTING BETWEEN SUBSTRATES |
摘要 |
The present invention aims to provide an apparatus for connecting between substrates capable of replacing a connector one by one. An apparatus for connecting between substrates A is provided with a connector 100 for electrically connecting an upside electrode 11 mounted at the back surface of an upside substrate 10 and a downside electrode 21 mounted at the front surface of a downside substrate 20 in a personal computer and a supporting plate 200 arranged between the upside substrate 10 and the downside substrate 20 for removably supporting the connector 100, and the connector 100 is able to be inserted into a positioning hole formed on the supporting plate 200 and has a mounting terminal 110 having a leading edge section being in contact with the downside electrode 21 and a connecting section 120 mounted at a base edge section of the mounting terminal 110 and having a leading edge section being in contact with the upside electrode 11.
|
申请公布号 |
US2004222535(A1) |
申请公布日期 |
2004.11.11 |
申请号 |
US20030430379 |
申请日期 |
2003.05.07 |
申请人 |
MORI CHIKAOMI;TAKAHASHI HIROTADA;KAWATA MASAO;NOJIRI KENICHI |
发明人 |
MORI CHIKAOMI;TAKAHASHI HIROTADA;KAWATA MASAO;NOJIRI KENICHI |
分类号 |
H01L23/02;H01L23/48;H01R13/24;(IPC1-7):H01L23/02 |
主分类号 |
H01L23/02 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|