发明名称 |
SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR |
摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device whose source region and base region are formed by ion injection by using the same mask and a manufacturing method therefor by improving the tradeoff relation between a channel resistance and a JFET resistance which is a problem arising when an element is made thin. SOLUTION: A longitudinal MOSFET which uses SiC has its source region 4 and base region 5 formed by ion injection by using the same mask 9 in a tapered shape and then the base region 5 is formed in the tapered shape. When a material having the same range of ion injection with SiC is used for the mask 9 in the tapered shape, the taper angle of the mask 9 is 30 to 60°and when SiO<SP>2</SP>is used, the taper angle is 20 to 45°. COPYRIGHT: (C)2005,JPO&NCIPI
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申请公布号 |
JP2004319964(A) |
申请公布日期 |
2004.11.11 |
申请号 |
JP20040017002 |
申请日期 |
2004.01.26 |
申请人 |
MITSUBISHI ELECTRIC CORP |
发明人 |
TARUI YOICHIRO;OTSUKA KENICHI;IMAIZUMI MASAYUKI;SUGIMOTO HIROSHI;TAKAMI TETSUYA |
分类号 |
H01L21/265;H01L21/04;H01L21/266;H01L21/336;H01L29/10;H01L29/12;H01L29/24;H01L29/78;(IPC1-7):H01L21/336 |
主分类号 |
H01L21/265 |
代理机构 |
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代理人 |
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地址 |
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