发明名称 SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR
摘要 PROBLEM TO BE SOLVED: To provide a semiconductor device whose source region and base region are formed by ion injection by using the same mask and a manufacturing method therefor by improving the tradeoff relation between a channel resistance and a JFET resistance which is a problem arising when an element is made thin. SOLUTION: A longitudinal MOSFET which uses SiC has its source region 4 and base region 5 formed by ion injection by using the same mask 9 in a tapered shape and then the base region 5 is formed in the tapered shape. When a material having the same range of ion injection with SiC is used for the mask 9 in the tapered shape, the taper angle of the mask 9 is 30 to 60°and when SiO<SP>2</SP>is used, the taper angle is 20 to 45°. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004319964(A) 申请公布日期 2004.11.11
申请号 JP20040017002 申请日期 2004.01.26
申请人 MITSUBISHI ELECTRIC CORP 发明人 TARUI YOICHIRO;OTSUKA KENICHI;IMAIZUMI MASAYUKI;SUGIMOTO HIROSHI;TAKAMI TETSUYA
分类号 H01L21/265;H01L21/04;H01L21/266;H01L21/336;H01L29/10;H01L29/12;H01L29/24;H01L29/78;(IPC1-7):H01L21/336 主分类号 H01L21/265
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