| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor heat treatment apparatus of superior sealing characteristics for coping with the demands of enlarging of diameter, enlarging of throughput and preventing of particle contamination, etc., in which there are less restriction in a form of an outer tube to be used, etc. and in usage, and there is sufficient durability of the outer tube even without supporting at an inner periphery. SOLUTION: A semiconductor heat treatment apparatus 60 comprises a silicon carbide outer tube 72, a base mount 65 supporting the outer tube 72 at a lower part in air-tight manner, a lid 66 openable and closable for an opening at a center part of the base mount 65, and a furnace wall 63 which surrounds an outer peripheral surface, etc. of the outer tube 72 and is provided with a heater 64 inside. An annular sealing member 68 and an annular supporting member 92 are interposed between the outer tube 72 and the base mount 65. An effective coefficient of heat transfer of the supporting member 92 is 50-2000 W/(m<SP>2</SP>K). COPYRIGHT: (C)2005,JPO&NCIPI
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