| 摘要 |
PROBLEM TO BE SOLVED: To provide a method and a device for arranging and mounting conductive ball by which high-quality bumps can be formed by appropriately, surely, and highly efficiently mounting conductive balls on an object to be mounted with the balls. SOLUTION: In the method, conductive balls B contained in a container are collectively mounted on the bump forming positions of the object to be mounted with the balls B at every unit mounting area S by sucking and arranging the balls B. Alternatively, the conductive balls B contained in the container are held by sucking and arranging the balls B, the held balls B are transferred by separately sucking and arranging the balls B, and the transferred balls B are collectively arranged and mounted on the bump forming positions of the object. More alternatively, the conductive balls B are held on areas larger than the unit mounting areas S by sucking and arranging the balls B, and the held balls B are transferred to areas equal to the unit mounting areas S by separately sucking and arranging the balls B. COPYRIGHT: (C)2005,JPO&NCIPI
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