| 摘要 |
The present invention relates to a method for supplying chips (2) to cavities (5) of a chip carrier web (4) by allowing the chips (2) to flow over the chip carrier web (4) in a medium. The medium is a gas. The presentinvention also relates to a method for attaching chips (2) to transponders on a transponder web (1)comprising successive and/or adjacent circuitry patterns (3), or to a structural part web, from which structuralparts are separated and attached to the transponder web. The chips (2), which are located in cavities (5) of achip carrier web (4), are attached to precise locations on the transponder web (1), or the structural part web by bringing the transponder web (1), or the structural part web and the chips (2) in contact with each other in a nip (N1). |
