METHOD AND APPARATUS FOR ELECTROPLATING METAL WIRING LAYER OF SEMICONDUCTOR DEVICE TO POLISH UNIFORMLY COPPER LAYER

摘要

PURPOSE: A method and an apparatus for electroplating a metal wiring layer of a semiconductor device are provided to polish uniformly a copper layer as the metal wiring layer by using plural cathodes. CONSTITUTION: A wafer(110) is dipped into an electrolyte(120) in order to perform an electroplating process. A positive polarity voltage is applied to the wafer. A negative polarity voltage is applied to an electrode which is arranged within the electrolyte. The electrode is formed with a main electrode and a plurality of sub-electrodes. The sub-electrodes are arranged on an upper part of the main electrode. The negative polarity voltage is applied sequentially to the main electrode and the sub-electrodes.