| 摘要 |
PROBLEM TO BE SOLVED: To prevent bubbles from entering the heat-conducting composition between a ceramic circuit board and a cooling member and hence prevent heat radiating properties from deteriorating due to warpage of a ceramic circuit board, caused by the heat generation of a semiconductor device. SOLUTION: With a ceramic circuit board, where a metal circuit board 2 is mounted to the upper surface of a ceramic substrate 1, and a metal plate 3 corresponding to the mounting region of the metal circuit board 2 is mounted to the lower surface, the semiconductor device 6 is packaged on the metal circuit board 2 and at the same time, is packaged on a heat radiating member 5 via a heat-conducting composition 4, in contact with the lower surface of the ceramic circuit board and the side surface of the ceramic substrate 1 in the semiconductor module. Even if the ceramic circuit board is warped or deformed, the end section of the heat-conducting composition 4 is not recessed, thus preventing air bubbles from entering the heat-conducting composition 4 and hence obtaining the highly reliable semiconductor module. |
