发明名称 Metal barrier film production apparatus, metal barrier film production method, metal film production method, and metal film production apparatus
摘要 A barrier metal film production apparatus, comprising: a chamber accommodating a substrate; a metallic etched member provided in the chamber at a position opposed to the substrate; source gas supply means for supplying a source gas containing a halogen into the chamber; plasma generation means which converts an atmosphere within the chamber into a plasma to generate a source gas plasma so that the etched member is etched with the source gas plasma to form a precursor from a metal component contained in the etched member and the source gas; excitation means for exciting a gas containing nitrogen in a manner isolated from the chamber; formation means for forming a metal nitride upon reaction between nitrogen excited by the excitation means and the precursor; control means which makes a temperature of the substrate lower than a temperature of the formation means to form the metal nitride as a film on the substrate for use as a barrier metal film; oxygen gas supply means for supplying an oxygen gas into the chamber immediately before formation of the most superficial layer of the barrier metal film is completed; and oxygen plasma generation means which converts the atmosphere within the chamber into a plasma to generate an oxygen gas plasma so that an oxide layer is formed on the most superficial layer of the barrier metal film.
申请公布号 EP1475455(A2) 申请公布日期 2004.11.10
申请号 EP20040017494 申请日期 2002.10.28
申请人 MITSUBISHI HEAVY INDUSTRIES, LTD. 发明人 SAKAMOTO, HITOSHI;YAHATA, NAOKI;MATSUDA, RYUICHI;OOBA, YOSHIYUKI;NISHIMORI, TOSHIHIKO
分类号 C23C16/448;H01L21/28;C23C8/36;C23C16/34;C23C16/452;C23C16/507;C23C16/56;C23C28/00;C23C30/00;H01L21/768;(IPC1-7):C23C14/00;C23C28/02;C23C14/02;C23C14/06;C23C14/16 主分类号 C23C16/448
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