Methods of forming dielectric materials and methods of processing semiconductor substrates,申请号US20030701301-传众专利搜索

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发明名称	Methods of forming dielectric materials and methods of processing semiconductor substrates
摘要
申请公布号	US6815375(B2)	申请公布日期	2004.11.09
申请号	US20030701301	申请日期	2003.11.03
申请人	MICRON TECHNOLOGY INC	发明人	MOORE JOHN T
分类号	C23C16/02;C23C16/34;H01L21/28;H01L21/314;H01L21/318;H01L29/51;(IPC1-7):H01L21/31;H01L21/469	主分类号	C23C16/02
代理机构		代理人
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