发明名称 Method for fabricating multiple-plane FinFET CMOS
摘要 The present invention provides FinFETs on the same substrate utilizing various crystal planes for FET current channels in order to optimize mobility and/or to reduce mobility. An embodiment of the present invention provides a substrate having a surface oriented on a first crystal plane that enables subsequent crystal planes for channels to be utilized. A first transistor is also provided having a first fin body. The first fin body has a sidewall forming a first channel, the sidewall oriented on a second crystal plane to provide a first carrier mobility. A second transistor is also provided having a second fin body. The second fin body has a sidewall forming a second channel, the sidewall oriented on a third crystal plane to provide a second carrier mobility that is different from the first carrier mobility.
申请公布号 US6815277(B2) 申请公布日期 2004.11.09
申请号 US20030645063 申请日期 2003.08.21
申请人 INTERNATIONAL BUSINESS MACHINES CORPORATION 发明人 FRIED DAVID M.;NOWAK EDWARD J.
分类号 H01L21/336;H01L21/84;H01L27/12;H01L29/04;H01L29/786;(IPC1-7):H01L21/823;H01L21/823 主分类号 H01L21/336
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