Heat treating method and heat treating device,申请号US20030473249-传众专利搜索

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发明名称	Heat treating method and heat treating device
摘要
申请公布号	US6814572(B2)	申请公布日期	2004.11.09
申请号	US20030473249	申请日期	2003.09.29
申请人	TOKYO ELECTRON LTD	发明人	OKABE TSUNEYUKI
分类号	C23C16/34;C23C16/44;C23C16/455;F27D7/06;F27D19/00;H01L21/00;H01L21/205;H01L21/31;(IPC1-7):F27B5/16	主分类号	C23C16/34
代理机构		代理人
主权项
地址

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