发明名称 |
Component assembly and method for producing the same |
摘要 |
In a component assembly and method for producing the same, the component assembly includes at least one component arranged on a support subframe, e.g., a printed circuit board. An insulator enclosing the component and including two isolating superimposed layers is also arranged on the support substrate. A sealing mass covering the component is arranged inside the insulator. The two or more isolating layers are made from the same isolating material and connected at the contact area.
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申请公布号 |
US6815263(B2) |
申请公布日期 |
2004.11.09 |
申请号 |
US20020276607 |
申请日期 |
2002.11.15 |
申请人 |
DR. JOHANNES HEIDENHAIN GMBH |
发明人 |
RISSING LUTZ;OBERMAYER FLORIAN |
分类号 |
H01L23/24;(IPC1-7):H01L21/44;H01L21/48;H01L21/50 |
主分类号 |
H01L23/24 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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