发明名称 SYSTEM AND METHOD FOR TREATING SEMICONDUCTOR SUBSTRATE USING LASER
摘要 PURPOSE: A system and method for treating a semiconductor substrate using laser are provided to perform a variety of processes on various semiconductor substrates by using control data determined from images of a slot and the substrates. CONSTITUTION: A system includes a storage part, a process control part, and a substrate treatment part. The storage part(110) stores control data for a slot according to treatment processes. A semiconductor substrate is loaded on the slot. The process control part(120) detects identification information of the slot. The process control part controls the treatment process of the semiconductor substrate by reading the control data corresponding to the identification information. The substrate treatment part(130) treats the semiconductor substrate by using laser beam having the predetermined energy corresponding to the read control data.
申请公布号 KR20040093677(A) 申请公布日期 2004.11.08
申请号 KR20030026588 申请日期 2003.04.26
申请人 HANTECH CO., LTD. 发明人 KIM, DAE JIN;KIM, HYEON JUNG;RYU, JE GIL
分类号 H01L21/00 主分类号 H01L21/00
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