SOLID STATE IMAGE PICK-UP DEVICE AND FABRICATING METHOD THEREOF TO MOUNT IMAGE PICK-UP DEVICE ON BASE UNIT

摘要

PURPOSE: A solid state image pick-up device is provided to mount an image pick-up device on a base unit by simplifying the structure of the base unit with outer terminals and by easily enabling miniaturization. CONSTITUTION: A flat-plate type substrate(1) is made of insulation resin. An image pick-up device(2) is fixed to the substrate. A rib(3) having a plane type rectangular frame is formed on the substrate to surround the image pick-up device. A light transmission plate(4) is fixed to the upper surface of the rib. A plurality of interconnections(6) perform an electrical derivation from the inside of a package formed by the substrate, the rib and the light transmission plate to the outside of the package. A metal thin line connects an electrode of the image pick-up device to each interconnection, installed in the space of the package. An inner electrode(6a) is formed on the mount surface of the image pick-up device. An outer electrode(6b) is formed in a position of the back of the mount surface corresponding to the inner electrode. A cross section electrode(6c) connects the inner electrode to the outer electrode, formed in the cross section of the substrate. The interconnection includes the inner electrode, the outer electrode and the cross section electrode. The cross section of the substrate, the side surface of the rib and the cross section of the light transmission plate that correspond to each side surface of the package have substantially the same plane.