| 摘要 |
PURPOSE: A method is provided to use a film for a dummy tape as a lead film of a flexible printed circuit board by permitting the film to maintain antistatic properties even at a high temperature of 150 to 200 Deg.C. CONSTITUTION: A method is characterized in that an antistatic layer of a dummy tape is formed by coating a conductive disperse solution on the surface of the film for the dummy tape. Alternatively, an antistatic layer of a dummy tape is formed by performing a sputtering, plasma, or ion beam treatment of aluminum, chrome, or copper metal onto the surface of the film under the inert gas atmosphere of one selected from a group consisting of nitrogen, argon, and neon. The film is selected from a group consisting of polyimide, polyether imide, polyamide imide, polyethylene naphthalate, polyether ether ketone, polyethylene terephthalate, and polyether sulfone.
|
