CIRCUIT BOARD WITH PROTRUSION ELECTRODE CAPABLE OF ENDURING SUFFICIENTLY FORCE APPLIED FROM LATERAL DIRECTION AND MANUFACTURING METHOD THEREOF, AND SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREOF

摘要

PURPOSE: A circuit board and a manufacturing method thereof, and a semiconductor device and a manufacturing method thereof are provided to obtain a protrusion electrode capable of enduring sufficiently the force applied from a lateral direction by enhancing the structure of the protrusion electrode. CONSTITUTION: A circuit board includes an insulating substrate(1), a plurality of conductive lines(2) arranged on the insulating substrate, and protrusion electrodes. The protrusion electrode(3) crosses the conductive line from one to the other side. At this time, Both ends of the protrusion electrode are connected with the insulating substrate. The center of the protrusion electrode rises higher than both sides.