POLISHING PAD HAVING OPTIMIZED GROOVE AND FORMING METHOD THEREOF WITH GRINDING LAYER TO FLATTEN SUBSTRATES

摘要

PURPOSE: A polishing pad is provided to appropriately compensate a relative rotation between a wafer and the polishing pad with a groove. CONSTITUTION: A grinding layer contains a radius, more than one continuous grooves and a CF(Circumference Fraction grooved). The radius is extended from the center of the grinding layer to an external circumference of the grinding layer. The continuous grooves are extended from the external circumference of the grinding layer inward by forming in the grinding layer. The CF is an area to be extended as an essential distance from the external circumference of the grinding layer to the center of the grinding layer. The CF is the part of a circumference to cross the continuous grooves to be divided by the entire circumference. The CF is within 25% of an average value as a function of the grinding layer radius in the extended area as the essential distance from the external circumference of the grinding layer to the center of the grinding layer.