| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device wherein electromagnetic noise from the semiconductor package is suppressed and, also, electromagnetic noise radiation due to the mesh current in the semiconductor package is suppressed. SOLUTION: The semiconductor device 10 has a substrate 11 which has on one of its surfaces a ground layer 15 and a circuit-constituting current guide line 16a, and has semiconductor packages 12, 13 having a connection terminal 12c connected to the current guide line 16a on the other of its surfaces. In the ground layer 15, a vacant section 17 is formed and arranged to run across the current guide line 16a. On the outer surfaces of the semiconductor packages 12, 13, conductive films 18, 21 are formed and connected to the ground layer 15. The current guide line 16a on the other side of the substrate 11 is so arranged as to run across the vacant section 17. At one side of the vacant section 17, one end of the current guide line 16a is connected to the conductive film 18 connected to the ground layer 15. At the other side of the vacant section 17, the other end of the current guide line 16a is connected to the conductive film 21 of the semiconductor package 13 connected to the ground layer 15. COPYRIGHT: (C)2005,JPO&NCIPI |
