| 摘要 |
PROBLEM TO BE SOLVED: To provide a high frequency switch module for eliminating the increase of transmission loss without affecting an electric characteristic. SOLUTION: The module includes: a multi-layer board; an outer circuit connecting terminal formed on the side surface or rear surface of the multi-layer board; a GaAs switch element formed in the multi-layer board, so as to alternatively transmit a transmission/reception signal through a transmission line for transmission/reception; a pad for mounting the GaAs switch element which is formed on the front surface of the multi-layer board; wiring formed in the multi-layer board, so as to electrically connect the pad for mounting the GaAs switch element to the outer circuit connecting terminal by minimum distance; and at least two grounded electrodes generated in the multi-layer board. The grounded electrodes are arranged at the upper and lower positions of the wiring by separation from the wiring. Another circuit element constituting the transmission line for transmission/reception is arranged in a part other than an area enclosed by the grounded electrodes in the multi-layer board. COPYRIGHT: (C)2005,JPO&NCIPI
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