| 摘要 |
PROBLEM TO BE SOLVED: To realize circuit editing of feature structures embedded under multiple layers by evenly removing the layers over them. SOLUTION: First, a variable pixel milling is used to evenly remove almost all dummy copper paddings and SiO<SB>2</SB>layers. The variable pixel milling is also used, combining with a technique to pass impinging ion through dummy layers formed on the surface layers to be removed so that more uniform removal may be performed. Prior to the removal of the next layer, focused ion beam sputtering with oxygen-containing gas smoothes the base of a trench. COPYRIGHT: (C)2005,JPO&NCIPI
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