SEMICONDUCTOR PROCESSING EQUIPMENT

摘要

PROBLEM TO BE SOLVED: To obtain semiconductor processing equipment in which a heat insulator is protected against break and damage when quick heating and quick cooling are performed. SOLUTION: The semiconductor processing equipment comprises a reaction chamber 4 for processing a substrate, and a heater 2 for heating the substrate 5 in the reaction chamber. The heater has a heating element 32, and a heat insulation layer on the outer circumferential side of the heating element. The heat insulation layer has a three layer structure from the heating element side toward the outer circumference wherein the bulk density of an intermediate heat insulation layer is lower than that of other layers. COPYRIGHT: (C)2005,JPO&NCIPI