发明名称 WIRING STRUCTURE OF SUBSTRATE AND WIRING FORMING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a wiring structure of a substrate capable of reducing unrequired electromagnetic radiation from wiring and reducing the reflection of signals transmitted to the wiring, and a wiring forming method. SOLUTION: The wiring 33 is provided with first wiring 45, second wiring 46 and third wiring 47. The first wiring 45 and the third wiring 47 are extended in directions to orthogonally cross each other, the second wiring 46 forms an obtuse angle to the first wiring 45 and the third wiring 47 and they are electrically connected. Thus, at the time of transmitting the signals, the reflection of the signals in an area where each wiring crosses is reduced. Also, by preventing the wiring 33 from being suddenly bent and suppressing the rapid change of the flowing direction of a current flowing on the surface of the wiring 33 by a skin effect, the unrequired electromagnetic radiation generated from an area where the wiring 33 is bent is reduced compared to a conventional technique. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004311723(A) 申请公布日期 2004.11.04
申请号 JP20030103324 申请日期 2003.04.07
申请人 SHARP CORP 发明人 MURAYAMA RINA;MATSUBARA KOJI;SATOU TOMOTOSHI;SUMIKAWA MASAHITO
分类号 H01L23/12;H01L25/10;H01L25/11;H01L25/18;(IPC1-7):H01L23/12 主分类号 H01L23/12
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