| 发明名称 |
Electronic substrate with direct inner layer component interconnection |
| 摘要 |
An electronic substrate for interconnecting electronic components comprises a substrate having one or more conductive inner layers and one or more interconnect cavities extending into the substrate to expose one or more of the inner layers.
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| 申请公布号 |
US2004219342(A1) |
申请公布日期 |
2004.11.04 |
| 申请号 |
US20030750560 |
申请日期 |
2003.12.31 |
| 申请人 |
BOGGS DAVID W.;SATO DARYL A.;DUNGAN JOHN H.;PAEK GARY |
发明人 |
BOGGS DAVID W.;SATO DARYL A.;DUNGAN JOHN H.;PAEK GARY |
| 分类号 |
H05K1/11;H05K3/40;H05K3/42;(IPC1-7):B32B3/00 |
主分类号 |
H05K1/11 |
| 代理机构 |
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代理人 |
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