发明名称 HIGH DIELECTRIC COMPOSITION
摘要 PROBLEM TO BE SOLVED: To obtain a high dielectric composition having a high relative dielectric constant of≥40 and excellent dielectric characteristic of low dielectric dissipation factor of≤2.0. SOLUTION: This high dielectric composition comprises an inorganic filler and a resin. The resin has an M-O bond (M is Ti or Ba). Preferably, the resin contains a compound selected from a hydrolyzable titanium compound, a hydrolyzable barium compound and their condensates. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004307607(A) 申请公布日期 2004.11.04
申请号 JP20030101227 申请日期 2003.04.04
申请人 TORAY IND INC 发明人 YAMAHO YUKA
分类号 C08L85/00;C08K3/00;H01B3/00;H01G4/12;(IPC1-7):C08L85/00 主分类号 C08L85/00
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