PROCESS OF FORMING A FERROELECTRIC MEMORY INTEGRATED CIRCUIT

摘要

A memory cell having capacitor with top and bottom electrodes with a dielectric layer between is described. The bottom electrode is coupled to a first diffusion region of a transistor by a bottom electrode plug. A dielectric layer covers the capacitor. Above the dielectric layer is a first barrier layer. A via is created in the dielectric layer in which a plug is formed to couple to the second diffusion region. The via comprises substantially vertical sidewalls. A second barrier layer lines the sidewalls of the via. A conductive material is then deposited on the substrate, filling the via to form the plug. By providing the first and second barrier layers, the diffusion of hydrogen which can adversely impact the capacitor is reduced, thereby improving the reliability.