| 摘要 |
PURPOSE: A probe assembly is provided to detect exactly an end point of a semiconductor wafer polishing process by sealing and protecting completely an optical fiber cable using a light transmitting protection cap without an additional sealing process for each light transmitting hole of a polish pad and a platen. CONSTITUTION: An optical fiber cable(32) is inserted in the first through hole(11a) of a platen(11). A cylinder type ferrule(31) is attached on a periphery of the optical fiber cable in order to protect and support the optical fiber cable. A polish pad(12) with the second through hole(12a) is attached on the platen. A light transmitting protection cap(60) with a protrusion is stably loaded in the first through hole of the platen in order to seal and protect an end portion of the optical fiber cable. At this time, the protrusion of the cap is inserted in the second through hole of the polish pad.
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