| 摘要 |
PROBLEM TO BE SOLVED: To provide a multilayer circuit board which can be manufactured at a low cost, can eliminate exfoliation of a conductor pattern, and is suitable for formation of a high frequency circuit; and to provide a method for manufacturing the multilayer circuit board. SOLUTION: In the multilayer circuit board 100, insulating substrates 1 and wiring layers formed of conductor patterns 2 are alternately laminated. Surface roughness 2er of an insulating substrate 1 side of a surface conductor pattern 2e exposed to the surface of the multilayer circuit board 100 is greater than surface roughness 2ir of an inner conductor pattern 2i buried in the multilayer circuit board 100. COPYRIGHT: (C)2005,JPO&NCIPI |
