| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer support member capable of measuring the surface temperature of a wafer accurately and with high traceability. SOLUTION: One of the main surfaces of a plate-like ceramic body 2 is used as a surface on which a wafer W is placed, a resistance heat producing body 5 is provided on the other main surface or inside the plate-like ceramic body 2, and a recess 9 is provided in the other main surface of the plate-like ceramic body 2. A temperature measuring body consisting of a temperature measuring element 8a and a lead wire 8 is inserted into the recess 9 and held by a fixing member 17, and the length of the lead wire 8 from the temperature measuring element 8a of the temperature measuring body to the fixing member 17 from which the lead wire 8 is exposed is set to a value more than twice and less than 30 times the diameter of the lead line 8. COPYRIGHT: (C)2005,JPO&NCIPI |
