| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To develop a surface-treated copper foil having such a surface layer as to facilitate a direct perforation by a carbon dioxide laser on the no-adhering side to a resin, which is performed to a copper foil for a printed circuit board, formed with a small amount of a coating by a simple method. <P>SOLUTION: The copper foil for laser direct working is provided with a layer of iron of 100 to 1,000 mg/m<SP>2</SP>on at least one side of the copper foil; or alternatively is provided with a layer made of an alloy comprising iron and one or more elements selected from among nickel, cobalt, zinc, chromium and phosphorus, in an amount of 100 to 1,000 mg/m<SP>2</SP>. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
