| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an epoxy resin molding material for sealing which is excellent in fillability and is suitable as an underfill material for flip chip packaging, and a flip chip-packaged semiconductor device sealed with the same which has a good reliability in terms of molding failure such as voids, reflow resistance, humidity resistance, etc. <P>SOLUTION: The epoxy resin molding material for sealing contains (A) an epoxy resin, (B) a hardener, (C) an inorganic filler and (D) a coupling agent. The (C) inorganic filler has a specific surface area of 3.0-6.0 m<SP>2</SP>/g. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
