发明名称 INSULATING FILM-FORMING MATERIAL AND INSULATING FILM
摘要 <p><P>PROBLEM TO BE SOLVED: To provide an insulating film-forming material which comprises a component capable of constituting a polybenzazole compound having a high crosslinking degree and, in particular, can easily realize a film thickness necessary for use as an interlayer insulating film, and an insulating film formed from the material. <P>SOLUTION: The insulating film-forming material comprises a polymerizable composition obtained by dissolving an adamantane polycarboxylic acid derivative represented by formula (1) (wherein X is a hydrogen atom, a hydrocarbon group or R<SP>4</SP>; R<SP>1</SP>-R<SP>4</SP>are the same or different and are each a carboxyl group or the like optionally protected with a protecting group; and Y<SP>1</SP>-Y<SP>4</SP>are the same or different and are each a single bond or a divalent aromatic cyclic group) and an aromatic polyamine derivative represented by formula (2) (wherein the ring Z is a monocyclic or polycyclic aromatic ring; and R<SP>5</SP>-R<SP>8</SP>are each a substituent group bonded to the ring Z and are, same or different, an amino group or the like optionally protected with a protecting group) in an organic solvent. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2004307804(A) 申请公布日期 2004.11.04
申请号 JP20030325519 申请日期 2003.09.18
申请人 DAICEL CHEM IND LTD 发明人 NAGANO SHINYA;HASHIMOTO HARUICHIRO;TSUTSUMI KIYOHARU;FUNAKI KATSUNORI
分类号 C08G73/06;C08G63/44;C08G73/10;C08G73/18;C08J5/18;C08L79/04;H01L21/312;(IPC1-7):C08G73/06 主分类号 C08G73/06
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