| 摘要 |
PROBLEM TO BE SOLVED: To provide a baking system capable of uniformly cooling over the whole area of the upper face of a hot plate, and remarkably reducing a cooling time. SOLUTION: The baking system includes a heat pipe on which a wafer to be baked is mounted on the upper face, a working fluid of a predetermined amount filled inside, and wicks formed on the side faces and the ceiling for supplying the working fluid; a heater used for heating the upper face by the heated working fluid; and an auxiliary cooler having liquid cooling medium to be exchanged with the working fluid in the heat pipe through circulation; a connection pipe for connecting the heat pipe with the auxiliary cooler for circulating the working fluid and the liquid cooling medium; and a control means provided on the connection pipe, for controlling the liquid flowing in the connection pipe. COPYRIGHT: (C)2005,JPO&NCIPI |
