发明名称 MANUFACTURING METHOD FOR FLEXIBLE PRINTED CIRCUIT BOARD
摘要 PROBLEM TO BE SOLVED: To manufacture a flexible printed circuit board which controls curling to the utmost, has superior dimensional stability, and can fully cope with macro circuits. SOLUTION: A metal composite film is manufactured by forming a first polyimide precursor layer by coating varnish for the first polyimide precursor, containing a polyamic acid component obtained by the reaction of acid anhydride and an amine component and a polyimide component, obtained by reaction of the acid anhydride and an isocyanate component in a range of 10 % to 70 % on a conductor 2, and by forming a second polyimide precursor layer coating varnish for the second polyimide precursor consisting of the polyamic acid component, obtained by reaction of the acid anhydride and the amine component on the first polyimide precursor layer. Then, a first polyimide resin layer 3a and a second polyimide resin layer 3b are formed by imidizing the first polyimide precursor layer and the second polyimide precursor layer by applying the metal composite film to heat treatment. COPYRIGHT: (C)2005,JPO&NCIPI
申请公布号 JP2004312042(A) 申请公布日期 2004.11.04
申请号 JP20040212076 申请日期 2004.07.20
申请人 SONY CHEM CORP 发明人 TAKAHASHI SATOSHI;OTA HIROMASA
分类号 H05K1/03;(IPC1-7):H05K1/03 主分类号 H05K1/03
代理机构 代理人
主权项
地址