| 摘要 |
PROBLEM TO BE SOLVED: To prevent circuits from interfering with each other, and to prevent variations in characteristics, or the like, from occurring when combining circuits having different functions for integration. SOLUTION: A module component comprises a first high-frequency device 2 that prints a conductive paste on an alumina substrate 1 for forming a coil and a capacitor and prints and forms an upper conductive pattern via cloth glass 5 for forming a specific circuit; a second high-frequency device 3 that prints the conductive paste to an upper section, where the conductive paste is printed on the alumina substrate 1 for similarly forming a ground layer 4, for forming the coil and the capacitor and prints and forms the upper conductive pattern via the cloth glass 5 for forming the specific circuit; and a land 6 for packaging and an end face electrode 7 provided in the first and second high-frequency devices, respectively. Then, the first high-frequency device is placed on the second one and both the devices are electrically connected for integration. COPYRIGHT: (C)2005,JPO&NCIPI
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