ELECTRONIC APPARATUS AND ITS MANUFACTURING METHOD

摘要

PROBLEM TO BE SOLVED: To solve the problem that possibilities of short-circuiting are high after attaching an electrode plate 3 when a substrate 21 and the electrode plate 3 are connected with a lead line which is not covered in the case that the electrode plate 3 is attached on the aperture 20 of a casing 2. SOLUTION: An open portion 4 is formed in a part of the casing 2. A land 22a and a coupling pin 32 to which an electronic component 3 is connected are soldered in the state that the coupling pin 32 is inserted in a connecting port 22. COPYRIGHT: (C)2005,JPO&NCIPI