| 摘要 |
A semiconductor package and a method of fabricating a semiconductor package are provided. The method of fabricating a semiconductor package provides a semiconductor die having a pad mounting surface and a plurality of bonding pads disposed on the pad mounting surface; attaches a medium on each of the bonding pads; arranges a spherical element on each of the bonding pads via the corresponding medium; forms an electroplating layer on each of the spherical elements and around the corresponding medium; and coats a protection layer on the pad mounting surface of the semiconductor die and the electroplating layers by means of a photoresist material. Furthermore, the protection layer is patterned and etched so as to expose the top portions of the electroplating layers.
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