发明名称 Method and apparatus for treating article to be treated
摘要 A thermal treatment apparatus 1 includes a reaction tube 2 for containing wafers 10 contaminated with organic substances having a heater 12 capable of heating the reaction tube; a first gas supply pipe 13 for carrying oxygen gas into the reaction tube 2; and a second gas supply pipe 14 for carrying hydrogen gas into the reaction tube 2. Oxygen gas and hydrogen gas are supplied through the first gas supply pipe 13 and the second gas supply pipe 14, respectively, into the reaction tube 2, and the heater 12 heats the reaction tube 2 at a temperature capable of activating oxygen gas and hydrogen gas. A combustion reaction occurs in the reaction tube 2 and thereby the organic substances adhering to the wafers 10 are oxidized, decomposed and removed.
申请公布号 US2004219793(A1) 申请公布日期 2004.11.04
申请号 US20040433423 申请日期 2004.06.16
申请人 HISHIYA SHINGO;FURUSAWA YOSHIKAZU;HAYASHI TERUYUKI;SAITO MISAKO;UMEZAWA KOTA;SATO SYOICHI 发明人 HISHIYA SHINGO;FURUSAWA YOSHIKAZU;HAYASHI TERUYUKI;SAITO MISAKO;UMEZAWA KOTA;SATO SYOICHI
分类号 C30B33/00;H01L21/00;H01L21/306;H01L21/311;H01L21/316;(IPC1-7):H01L21/302;H01L21/461 主分类号 C30B33/00
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