THERMOSETTING RESIN COMPOSITION, MULTILAYER BODY USING SAME, AND CIRCUIT BOARD

摘要

A thermosetting resin composition which is suitably used for manufacturing circuit boards such as flexible printed circuit boards (FPC) or buildup circuit boards is disclosed. A multilayer body and a circuit board manufactured by using such a thermosetting resin composition are also disclosed. By using a thermosetting resin composition which contains a polyimide resin component (A), a phenol resin component (B), and an epoxy resin component (C) and has a mixing ratio by weight (A)/[(B)+(C)] within the range of 0.4-2.0 that represents the ratio of the component (A) to the total weight of the component (B) and the component (C), there can be obtained a multilayer body or a circuit board which is excellent in dielectric characteristics, adhesiveness, workability, heat resistance, and liquidity. By using a thermosetting resin composition which contains a polyimide resin (A), a phosphazene compound (D), and a cyanate ester compound (E), wherein a phenoxyphosphazene compound (D-1) having a phenolic hydroxyl group and/or a crosslinked phenoxyphosphazene compound (D-2) which is obtained by crosslinking the phenoxyphosphazene compound (D-1) and has at least one phenolic hydroxyl group are contained as the phosphazene compound (D), there can be obtained a multilayer body or a circuit board which is excellent in dielectric characteristics, workability, heat resistance, and flame retardance.