DEVICE AND METHOD FOR DRILLING HOLES IN AN ELECTRIC CIRCUIT SUBSTRATE

摘要

A laser (1) produces a coherent beam of light (2) which is reflected from a first oscillating mirror (51) onto a second oscillating mirror (52). The oscillations (S1,2) of the two mirrors are sine waves with a 90 degree phase difference. The light beam is reflected through approximately 90 degrees in a scanner (3) with a movable mirror. It is then concentrated by a lens (4) onto a focus point (F) at various positions (15) on the conducting substrate (10) to bore holes (14) through the three layers (11-13) making up the substrate.