| 摘要 |
<P>PROBLEM TO BE SOLVED: To dissipate heat efficiently from an LED chip to a heat dissipating element through a simple arrangement. <P>SOLUTION: A deep recess 21a is provided on one surface side of a ceramic substrate 21 and a shallow recess 21b is provided around the deep recess 21a. An LED chip 22 is die bonded to a wiring pattern provided in the recess 21a and the electrode of the LED chip 22 is bonded to a wiring pattern on the shallow recess 21b of the ceramic substrate 21 by a connecting wire 23. A heat dissipating element 4 is bonded directly to the surface (rear surface) of the ceramic substrate 21 on the side opposite to the light emitting surface side. A connecting substrate 3 is provided with a window part 31 for passing light from an LED element substrate 2. <P>COPYRIGHT: (C)2005,JPO&NCIPI |
