发明名称 WATER COOLING HEAT SINK AND WATER COOLING UNIT
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a water cooling heat sink in which water is made to flow in the heat sink by a diffusion junction, thereby cooling the water efficiently and also a water cooling unit capable of cooling a plurality of heat sinks or electronic components concurrently. <P>SOLUTION: In the heat sink, a base material is interposed between the fins, an interface disappears by the diffusion junction and the fin is integrally joined to a base. The fin and the base material are perforated for a water path for passing water and a hose connector for connecting a hose to one side surface of the base is provided. Thus, the following effect can be attained. (1) Water (an air) is made to flow in the heat sink by the diffusion junction, thereby cooling the water (air) efficiently (at the high thermal conductivity). (2) A simple and easy processing and a low production cost. (3) In the water cooling unit, the plurality of heat sinks (electronic components, etc.) are cooled concurrently. (4) In cooling a CPU in a personal computer, etc., since an external cooling system can be constructed by combining a Peltier element, the heat sink and the fan, only the heat sink is provided in the personal computer to obtain a dew drop preventing effect. (5) A pump is controlled to control the cooling temperature. (6) An effective and wide application range can be obtained for the heat of not only the personal computer but also a small-sized apparatus. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2004311911(A) 申请公布日期 2004.11.04
申请号 JP20030137977 申请日期 2003.04.08
申请人 AKANE:KK;DAIHAKU KOGYO KK;OKUMOTO TEKKOSHO:KK;YAMADA SEIMITSU KOGYO KK;SHINWA KINZOKU KK;SANTEC:KK;NIKKO SHOJI KK 发明人 SUNAMOTO KENICHI;YAMAGUCHI TOSHIO;OKUMOTO BUNJI;YAMADA KOJI;SHINTANI TETSUAKI;TANAKA ATSUMI;NOSAKA SEIJI
分类号 F25D17/02;F25B21/02;F25D9/00;G06F1/20;H01L23/473;H05K7/20;(IPC1-7):H01L23/473 主分类号 F25D17/02
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